Description

Memory corruption while creating a LPAC client as LPAC engine was allowed to access GPU registers.

INFO

Published Date :

2024-06-03T10:05:26.653Z

Last Modified :

2024-08-01T23:06:24.158Z

Source :

qualcomm
AFFECTED PRODUCTS

The following products are affected by CVE-2024-23360 vulnerability.

Vendors Products
Qualcomm
  • Fastconnect 6700
  • Fastconnect 6700 Firmware
  • Fastconnect 6900
  • Fastconnect 6900 Firmware
  • Fastconnect 7800
  • Fastconnect 7800 Firmware
  • Sc8280xp-abbb
  • Sc8280xp-abbb Firmware
  • Sc8380xp
  • Sc8380xp Firmware
  • Snapdragon 7c\+ Gen 3 Compute
  • Snapdragon 7c\+ Gen 3 Compute Firmware
  • Wcd9380
  • Wcd9380 Firmware
  • Wcd9385
  • Wcd9385 Firmware
  • Wsa8830
  • Wsa8830 Firmware
  • Wsa8835
  • Wsa8835 Firmware
  • Wsa8840
  • Wsa8840 Firmware
  • Wsa8845
  • Wsa8845 Firmware
  • Wsa8845h
  • Wsa8845h Firmware
REFERENCES

Here, you will find a curated list of external links that provide in-depth information to CVE-2024-23360.

URL Resource
https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2024-bulletin.html cve-icon cve-icon cve-icon
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